Precision PCB Assembly from Prototype to Production
ISO 9001:2015-driven processes, high-speed SMT lines, and strict quality control to bring your electronics to life with reliability, repeatability, and scale.
ISO 9001:2015 processes with IPC-trained operators on every SMT and THT line.
Dedicated lanes for NPI, quick-turn prototypes, and high-volume production programs.
SPECIFICATIONS
Technical Capabilities
Our manufacturing lines are configured to handle a wide range of complex requirements, from prototype agility to production volume.
WHAT WE DO
End-to-End PCB Assembly Services
From single-layer to complex multi-layer boards with fine-pitch BGAs, our lines are tuned to handle both prototype volumes and production runs at scale.
IPC-certified engineers and operators monitor every step—from paste printing and placement to reflow, inspection, and testing— so each board meets your reliability targets.
INDUSTRY FOCUS
PCB Assemblies for Critical Applications
We support customers across regulated, safety-critical, and high-reliability domains with documented, traceable processes.
Automotive
AEC-Q200 compliant assemblies for automotive electronics.
Medical Devices
Support for ISO 13485 flows for medical electronics.
Industrial IoT
Rugged designs for harsh industrial environments.
Consumer Electronics
High-volume, cost-optimized consumer electronics builds.
Telecommunications
High-reliability assemblies for telecom infrastructure.
Aerospace & Defense
Stringent process controls for mission-critical systems.
Maximize Yield, Minimize Total Cost
We leverage DFM reviews, BOM engineering, and lean manufacturing to reduce your landed cost without compromising on reliability or performance.
DFM and DFA input during early design stages.
Bulk and alternate-component sourcing strategies.
Lean production scheduling to reduce changeover time.
Scrap and rework reduction through in-line checks.
Flexible volume-based commercial models.
HOW WE WORK
A Structured 6-Step Assembly Process
Each stage has defined inputs, outputs, and quality checks.
Design for Manufacturing (DFM)
Pre-production analysis to optimize footprint, thermal, and panelization efficiency.
Sourcing & IQC
Component procurement and rigorous Incoming Quality Control verification.
SMT & Reflow
Screen printing, component placement, and N2 reflow soldering.
AOI & X-Ray
Automated inspection of solder joints, component presence, and BGA voids.
Through-Hole & Wave
Selective soldering or wave soldering for THT components.
Functional Test & QA
Loading firmware, FCT testing, and final QA prior to packing.
EQUIPMENT
Advanced Technology on the Line
Modern SMT, inspection, and thermal systems ensure repeatable, measurable quality.
High-Speed SMT Lines
Dual-lane lines capable of 100,000+ CPH, handling 01005 passives and large ICs with ease.
Advanced X-Ray (AXI)
Non-destructive verification of BGA/QFN solder voiding and wire-bond integrity.
3D AOI & SPI
Volumetric inspection of solder paste and placed components to prevent defects at the source.
Nitrogen Reflow Ovens
10-zone reflow profiling with N2 atmosphere for superior wetting and joint quality.
SERVICE MENU
Built Around Your Assembly Needs
Mix and match services from prototyping through full-box builds.
Surface Mount Technology (SMT)
Precision placement of 01005 passives, CSPs, and Flip Chips using intelligent feeders and traceability logs.
Through-Hole Technology (THT)
Automated insertion and selective soldering for high-reliability power components and connectors.
Mixed Technology Assembly
Seamless integration of SMT and THT processes on complex multi-layer boards.
BGA & µBGA Expertise
Advanced ball grid array assembly with precise temperature profiling and 100% X-ray verification.
Lead-Free & RoHS Compliant
Environmentally friendly assembly meeting global compliance standards.
Automated Optical Inspection (AOI)
State-of-the-art AOI systems ensuring zero-defect manufacturing.
Rigorous Quality Control, End-to-End
Multiple checkpoints ensure that every assembly leaving the line is fully inspected, validated, and ready for integration into your product.
Incoming component inspection and verification.
In-process AOI and X-ray for hidden joints.
Functional testing, burn-in, and custom test jigs.
Final visual inspection and ESD-safe packaging.